Manufacturing

Wafer Bumping Technologies

Electroless Ni/Immersion Au UBM plating.

Seventeen years of experience plating electroless nickel and immersion gold (e-Ni/Au) on semiconductor devices (1-35 µm tall). Applications include: flip chip wafer bumping, wire bonding, anisotropic conductive adhesives (ACA), high temperature environments, and wafer level packages (WLCSP).

 

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Solder deposition of wet paste or solid diameter spheres and reflow.

Stencil printed bumping services using solder paste or solid diameter spheres for flipchip and wafer level CSP. Serving military, automotive, medical and consumer market segments. High yield processing with eutectic PbSn (37/63), high lead (90/10), and lead free (SnAgCu) solder bumps.

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Inspection and test.

  1. 100% inspection of wafers for bump yield.
  2. Sample plan for bump shear.
  3. Sample plan for bump height.
  4. Alloy composition tolerance of +/- 0.1 wt%

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Wafer Bumping and Related Services

Products & Services

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Business Development

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Design Guide

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