Applications/Markets

It is quite possible that a product you use contains parts that were processed at ICI in their wafer level form. Following wafer bump at ICI, a diverse product mix has passed customer qualification, been field tested, and moved into production. Below is a sampling of ICI processed parts, spanning most of the semiconductor categories and applications.

These include:

Discretes

Fuses
Resistors
Inductors
Capacitors

High Power Devices

FETs

RFID Tags

Labels
Implants

MEMs

Accelerometers
Micromirrors

Smart Cards

Memory
Security

Memory

DRAM
SRAM

Sensors

Hearing Aids
Diodes
Image

Medical

Pacemakers
Implants

Automotive

Under Hood
Passenger Compartment

Space

Satellites

Interested in wafer bumping for a product not listed here? Just ask us-our experience with unique process applications allows us to help you evaluate your product and our processes for best fit.

 

Wafer Bumping and Related Services

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