Capabilities

IC Interconnect has invested in state-of-the-art equipment and facilities. Quality systems are in place and have been certified to ISO 9001:2008 standards. The facility has a bumping capacity of over 250K wafers annually and is capable of processing wafers with the following characteristics:

Wafer Sizes:

3,4,5,6, and 8 inch (75-200mm) in production; 12 inch (300mm) in production for ENIG

Wafer Types:

Silicon, GaAs, InP, SiGe, Glass

Pad Metallization:

Al/Si/Cu, Al/Cu, Copper in prototype

Passivation Types:

SiO2, Si3N4, PI, BCB, Photoresist

Backside Properties:

Oxide, Silicon, Ground, Resist

 

Wafer Bumping and Related Services

Products & Services

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Business Development

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Design Guide

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