A knowledgeable staff, proven technology, and state-of-the-art equipment set are the keys to our high yielding bumping process. By eliminating vacuum metal deposition, photolithography, and etch processes, IC Interconnect is able to offer high quality wafer bumping at an attractive price.


Pricing is based on both wafer volume and services provided. In order to better quote the cost of a job, a Request For Quote has been provided in the menu of this web site which will allow IC Interconnect to assess the job requirements and then provide a written quote.


Wafer Bumping and Related Services

Products & Services

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Business Development

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Design Guide

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