Backend Services Headline

Back-end Services

ICI offers:

Backside Laser Mark

ICI offers both white mark and black mark.

Wafer Grind

Wafer Dicing

Backside polymer Coat

Photo Inspect


  1. 100% inspection of wafers for bump yield
  2. sample plan for bump shear
  3. sample plan for bump height


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Wafer Bumping and Related Services

Products & Services

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Design Guide

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