Electroless Nickel/Immersion Gold Under Bump Metallurgy (UBM)
Twenty years of experience plating electroless nickel and immersion-or flash-Gold (e-Ni/Au) on semiconductor devices, with Ni heights of 1-35um tall. Applications include: flip chip wafer bumping, wire bonding, anisotropic conductive adhesives, high temperature environments, and wafer level packages (WLCSP).
ICI offers I/O resurfacing for wire bond enhancement and high temperature operations. Standard processing is E-Ni/Au at 1-5 μm height.
Tall Ni services are ideal for applications such as isotropic/anisotropic conductive adhesives. Standard processing allows for E-Ni/Au at 5-35 μm height.