ENIG

Electroless Nickel/Immersion Gold Under Bump Metallurgy (UBM)

Twenty years of experience  plating electroless nickel and immersion-or flash-Gold (e-Ni/Au) on semiconductor devices, with Ni heights of 1-35um tall. Applications include: flip chip wafer bumping, wire bonding, anisotropic conductive adhesives, high temperature environments, and wafer level packages (WLCSP).

IO Resurfacing

ICI offers I/O resurfacing for wire bond enhancement and high temperature operations. Standard processing is E-Ni/Au at 1-5 μm height.

Tall Nickel

Tall Ni services are ideal for applications such as isotropic/anisotropic conductive adhesives. Standard processing allows for E-Ni/Au at 5-35 μm height.

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Wafer Bumping and Related Services

Products & Services

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Business Development

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Design Guide

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