Solder Bumping

Solder Bumping

Includes deposition of wet solder paste or solid diameter spheres, and reflow.

Stencil printed bumping services using solder paste or solid diameter spheres for flip chip and wafer level chip scale packaging (WLCSP) serving military, automotive, medical, and consumer market segments. High yield processing with eutectic PbSn (37/63), high lead (90/10), and lead free (SnAGCu) solder bumps.

 

Conventional Flip Chip

ICI offers conventional flip chip wafer bumping services using three standard lead and lead free solder alloys:

  1. E-Ni/Au + Eutectic Solder
  2. E-Ni/Au + High Lead Solder
  3. E-Ni/Au + SnAgCu

ICI can process orders requiring nonstandard solder alloys upon customer request.

 

Wafer Level Chip Scale Packaging

Wafer Level Chip Scale Packaging (WLCSP) wafer bumping is accomplished with standard lead and lead free solder alloys at 3 standard diameters:

  1. E-Ni/Au + 250 μm Ball Drop
  2. E-Ni/Au + 300 μm Ball Drop
  3. E-Ni/Au + 500 μm Ball Drop

ICI will address custom alloys and sphere sizes on a case by case basis.

 

Customer UBM

  1. Supplied UBM + Eutectic Solder
  2. Supplied UBM + High Lead Solder
  3. Supplied UBM + SnAgCU

 

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Wafer Bumping and Related Services

Products & Services

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Business Development

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Design Guide

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